University

Introducing the TI-RSLK MAX

Create • Explore • Imagine

The newest addition to the TI-RSLK product family, the TI-RSLK MAX is easy to use, build and test, with a solderless assembly that allows students to have a fully-functioning system up and running in less than 15 minutes.

TI-RSLK MAX was developed in collaboration with Jon Valvano, Ph.D., professor, electrical and computer engineering at The University of Texas at Austin.


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